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Die Attach & Wirebonding

Amplus Communication is equipped with precision die bonder that can perform various types of dies attach depending on customer placement accuracy. We have manual and fully auto wirebonder that can achieve fine pitch wirebonding with Au, AL ball-wedge, wedge-wedge and Ribbon material. Customers can customize bonding based on various prototype and process buyoff.

 

Our Services:-

• Precision Die Attach (PCB, CoC, Si Package)
• Placement Accuracy (+/-15um --> +/-0.5um)
• Flip Chip Bonding
• Eutectic Bonding
• Customize Pickup & Bonding Tool
• Process Capability Index Buyoff
• Au Ball-Wedge, Wedge-Wedge, Ribbon & Al WireBonding
• Fine Pitch WireBonding
• Customer Specified Requests

 

Dream Services

• PCB Services
• Surface-Mount Technology
• Test Equipment, Software
  & Fixture Design
• Die Attach & WireBonding
• Optical Alignment & Assembly
• Mechanical / Reliability & FA Analysis
• Other Services