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Surface-Mount Technology

Amplus Communication provides SMT assembly, where components are mounted by placing them directly onto the PCB’s surface. We have capabilities to assemble SMT prototype PCB in small production run with manual and/or automated SMT production processes, including single or double-sided component insertion.

 

Our Capabilities:-

• Ball Grid Array (BGA)
• Ultra-Fine Ball Grid Array (uBGA)
• Quad Flat Pack No-Lead (QFN)
• Quad Flat Package (QFP)
• Small Outline Integrated Circuit (SOIC)
• Package-on-Package (PoP)
• Small Chip Package (Pitch of 0.2mm)
• Support up-to 01005 Component Mount
• Customer Specified Requests

 

Dream Services

• PCB Services
• Surface-Mount Technology
• Test Equipment, Software
  & Fixture Design
• Die Attach & WireBonding
• Optical Alignment & Assembly
• Mechanical / Reliability & FA Analysis
• Other Services