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Positions Available

 

Engineer (Die/Wire Bonding - Training Provided)

Responsibilities:

  • Develop and optimize bonding process parameters, including temperature, force, and time
  • Troubleshoot process deviations and work with customers on R&D requirements
  • Work on Die Bonding, Wire Bonding, Optical Alignment, and Rework processes

 Requirements:

  • Minimum Diploma in Electronics Engineering
  • Minimum 2 years of experience in an electronics manufacturing environment or related technical environment
  • Ability to troubleshoot PCBA and perform mechanical and microchip assembly, including handling Epoxy materials
  • Hands-on experience with Die Bonding, Wire Bonding, and operating and maintaining bonding machines is preferred; training will be provided for candidates without prior experience
  • Willingness to learn and able to work independently and as part of a team
  • Ability to support and manage R&D customer requests
  • Knowledge of semiconductor packaging, advanced interconnects, or similar high-precision assembly is an advantage

 

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